Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2) and full compatibility with TSMC’s 16nm FinFET CMOS ...
The colorful pottery created by the ancient Paracas culture, which depicts a variety of abstract forms, people, and animals, would have perked up their drab surroundings on the southern Peruvian ...
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