Apple has finally unveiled the new iPhone 14 and iPhone 14 Pro. The Apple cynical may think that there probably isn't a huge difference between them. Indeed, many components are the exact same between ...

HSINCHU, July 15, 2025 -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for ...

Hsinchu, Taiwan – July 15, 2025 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express™ (UCIe™) ...

Apple is developing many new M5 and M6 Mac configurations, and we now have exclusive details on exactly what the company is developing. Through our own data and information shared with us, ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

TSMC’s advanced CoWoS and SoIC lines have become the key bottleneck for AI memory bandwidth, giving the company commanding pricing power. The foundry is replicating this 3D packaging and wafer ...

Texas Instruments' RES60A-Q1 integrated, 1.4-kV, single-chip thin-film resistor divider helps extend the lifetime of hybrid, electric-vehicle, and battery energy storage system (BESS) batteries when ...

Apple regularly refreshes the MacBook Pro models, and a new version that uses M5 series chips is in the works. Apple just finished refreshing most of the Mac lineup with M4 chips, and now it's time ...

TAIPEI (Taiwan News) — TSMC’s advanced packaging plants AP8 in Southern Taiwan Science Park and AP7 in Chiayi are set to enter production in the second half of this year, Commercial Times reported ...

Apple will bring its next-generation M5 chip to the MacBook Pro in the fall, followed by the iPad Pro in the first half of 2026, according to Bloomberg's Mark Gurman. Gurman's latest claim flips the ...