Japanese battery innovators are racing to solve the slow‑charging bottleneck that still frustrates drivers and device makers, ...

Abstract: The pursuit of higher packing density has propelled the shift towards three-dimensional (3D) integrated circuits (3D-ICs), promising heightened performance, accelerated data speeds, and ...

This efficiency challenge is caused by diffuser plates, sometimes called showerheads, used during semiconductor processing.

Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

The 3D NAND Flash Memory Market is driven by increasing demand for higher storage capacities in smartphones, laptops, and data centers. Advancements in AI and IoT, requiring robust data storage ...

Apple and Huawei are reportedly developing new 3D face scanning technology that could enable smaller cutouts or under-display ...

LAS VEGAS, NV / ACCESS Newswire / January 2, 2026 / Innolux will showcase its next-generation display technology in Las Vegas, USA from January 6 to 8, under the theme "Display the Future, TOGETHER." ...

Himax Technologies, Inc. (“Himax” or “Company”) (Nasdaq: HIMX), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, and AUO Corporation (“AUO”) (TWSE: 2409 ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

At the press conference, Brandon Cho, CEO and co-founder of SEMIFIVE, said, "Just as TSMC has platformized semiconductor manufacturing, SEMIFIVE is lowering barriers to entry by platformizing ...