Abstract: Neurological and brain-related cancers are one of the main causes of death worldwide. A commonly used tool in diagnosing these conditions is Magnetic Resonance Imaging (MRI), yet the manual ...

Abstract: Die stacking is commonly used in memory modules. Solder micro-bumps and through silicon via (TSVs) are common interconnects, and it may not viable or suitable for device that has bump pitch ...

The Waterfall framework and the Agile software development process are two competing software development approaches, and the two of them couldn't be more different. Here are the important highlights ...

Barnaby Joseph Dye has received multilple grants and a scholarship from the UK's Research Councils (mainly Economic and Social Science Research Council) and the British Academy. He is a member of the ...