A new single-chip Bluetooth LSI, designated the TC35654, integrates both RF and baseband circuits The chip employs a 0.18 µm CMOS process technology for the RF circuit instead of the usual bipolar ...
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of two 2.4 GHz RF transceiver technologies ...
TDC has launched a Bluetooth module with an open-field range of one kilometre from its internal antenna, the longest range of any Bluetooth module. The range can be further extended by adding high ...
SAN JOSE, Calif., December 09, 2002 -- Toshiba America Electronic Components, Inc. (TAEC) today announced a new single-chip Bluetoothâ„¢ large scale integration (LSI) that integrates radio frequency ...
Announced at ISSCC 2022: Impedance Tuning and Reference Signal Self-Correction Technologies Can Facilitate Bluetooth LE Implementation in IoT Devices Reference Signal Self-Correction Circuit ...
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