Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...

The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...

Fairchild Semiconductor’s BGA packaged power MOSFETs are not currently available from a second source. However, the company has addressed the second-source issue by developing a dual layout, which ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

It was almost a year ago when we first heard details about AMD's plans for its top-dog mobile part for Zen 5, which goes by the name Strix Halo. For Zen 5 in laptops, AMD is developing two lines of ...

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down ...